MSE 5420

MSE 5420

Course information provided by the Courses of Study 2017-2018.

Design, materials, and manufacturing needs for flexible electronics from chip to board. Principles involved in key areas of materials science and other engineering disciplines. Flexible electronics packaging materials to be discussed include metals, ceramics, and polymers.

When Offered Fall.

View Enrollment Information

  •   Regular Academic Session. 

  • 3 Credits Graded

  • 16750 MSE 5420   LEC 001